Metal working machinery and appliances; semiconductor manufacturing machines and systems; machines for dicing semiconductor wafers into chips by blade, by means of laser; grinding machines for use in semiconductor manufacturing process; UV irradiation machines, electron beam irradiation machines, and energy line irradiation machines, all being for use in semiconductor manufacturing process; machines for adhering surface protection tapes, machines for adhering backside protection tape, both being for use in semiconductor manufacturing process; machines for releasing surface protection tape, machines for releasing backside protection tape, both being for use in semiconductor manufacturing process; machines for issuing and adhering, for reading, and for writing bar code label and radio frequency identification (RFID) label, all being for use in semiconductor manufacturing process; metal working machinery and appliances comprising cutting machines for semiconductor wafers, tape adhering machines, grinding machines, transporting machines and tape replacing machines; semiconductor wafer processing machines and parts thereof; semiconductor wafer washing machines; feeding machines, transferring machines, and storing machines, all for semiconductor wafers; machines for exchanging wafers among semiconductor wafer containers; heating machines, pressurizing machines for processing semiconductor wafers; cutting machines, and punching machines, both being for use in semiconductor wafer processing tapes; machines for picking up diced semiconductor chips; printing/book making machines and appliances; wrapping machines and appliances; automatic labeling machines and appliances; other labeling machines and appliances

Bar code printers; thermal transfer printers; laser printers; ink jet printers; thermal printers; printers; applied electronic machines and appliances (excluding Geiger counters, high-frequency sewing-machines, cyclotrons, X-ray machines and appliances for industrial purposes, betatrons for industrial purposes, magnetic prospecting machines and appliances, magnetic detecting machines and appliances, seismic detecting machines and appliances, hydrophonic machines and appliances, ultrasonic depth sounders, ultrasonic flaw detectors, ultrasonic detecting machines and appliances, electronically applied automatic door opening-closing machines and appliances, electronic microscopes); programs for electronic calculators; frames adapted to carry semi-conductor wafers for use in semiconductor wafer processing work; storing containers, transferring containers, and transporting containers, all adapted to carry semi-conductor wafers and all for use in processing semiconductor wafers; storing containers, transferring containers, and transporting containers, all adapted to carry semiconductor wafers and all for use with frames to be used in processing semiconductor wafers