Machines and apparatus for producing and/or aligning and/or adjusting and/or bonding and/or coating and/or developing and/or cleaning and/or printing and/or lithographic treatment, in particular nano-imprinting, hot-embossing, micro-contact printing and/or inspecting and/or packaging of electronic circuitry or semi-conductors, in particular of wafers; parts and fittings for the aforementioned machines and apparatus, included in this class